Rigid PCB Capability

No

Item

Technical data

1

Number of Layers

1-40Layers

2

Max.Board Size

508*610mm

3

Board thickness

0.2-5.0mm

4

Min Line Width/Space

4mil/4mil(0.1/0.1mm)

5

Min.S/M Pitch

0.1mm(4mil)

6

Finish Drill Hole (Mechanical)

0.2mm--6.30mm

7

PTH Wall Thickness

>0.020mm(0.8mil)

8

Hole Dia.Tolerance(PTH)

±0.075mm(3mil)

9

Hole Dia.Tolerance(NPTH)

±0.05mm (2mil)

10

Hole Position Deviation

±0.05mm (2mil)

11

Outline Tolerance

±0.10mm (4mil)

12

Twist&Bow

≤0.7%

13

Insulation Resistance

>1012Ω Normal

14

Through hole resistance

<300Ω Normal

15

Electric strength

>1.3 kv/mm

16

Current breakdown

10A

17

Peel strength

1.4N/mm

18

S/M abrasion

>6H

19

Thermal stress

288℃ 20 Sec

20

Test Voltage

50-300V

21

Min. blind/buried via

0.2mm/0.2mm(Mechanical)

0.1mm/0.2mm(Laser)

22

Available Laminates Material

CEM1, CEM3, FR-4, High-Tg FR4, Aluminum Base, Rogers, Taconic, Arlon etc.

23

Finished board thickness tolerance

T>=0.8mm, Tolerance: +/-8%, T<0.8mm : +/-10%

24

Out Layer Copper Thickness

1oz--6oz

25

Inner Layer Copper Thickness

1/2oz--4oz

26

Aspect Ratio

15:1

27

SMT Mini. Solder Mask Width

0.08mm

28

Mini. Solder Mask Clearance

0.05mm

29

Plug Hole Diameter

0.2mm--0.60mm

30

Impedance Control Tolerance

+/-10%

31

Surface Finish

HASL,HAL（Lead free）,Immersion Gold/Tin/Silver，Gold Plated, OSP, Gold Finger, Peelable mask

32

Insulation Layer Thickness

0.075mm--5.00mm

33

Special technology

Thick hard gold plating, Via in Pad, Counterbore&Countersunk etc.