No
Item
Technical data
1
Number of Layers
1-2Layers
2
Material
Aluminum / Copper base
3
Final Thickness
0.5-3.0mm
4
Max Size
1200mm x 600mm
5
Insulating Layer Thickness
50, 75, 100, 125, 150micron
6
Min trace Width/Spacing
6mil/6mil(0.15/0.15mm)
7
Copper Thickness
0.5oz-3oz
8
Min hole size
0.6mm
9
Thermal Conductivity
1.0-4.0W/m.K
10
Aluminum Type
3003, 5052, 6061 etc.
11
Breakdown voltage
2-8KV
12
Min Solder Dam
4mil
13
Min Hole Ring
14
Twist&Bow
≤0.7%
15
Test Voltage
50-300V
16
Solder Mask Colour
White, Black, Red, Green, Blue, Yellow
17
Silkscreen colour
White, Black
18
Tolerance of Profile
+/-5mil
19
Peel Strength
≥ 1.8 N/MM
20
Surface Resistance
≥ 1*105 M
21
Permittivity
≤ 4.4
22
Disspation Factor
≤ 0.03
23
Surface Treatment
HAL(Lead.free), Immersion gold/Tin, OSP, Gold plating