|
Flexible PCB Capability |
|
No |
Item |
Technical data |
|
1 |
Number of layers |
Flex: 1~6layer
Rigid/flex: 2-10layer |
|
2 |
Min trace Width/Spacing |
12 & 18um (base Cu): 0.075/0.075mm
35um (base Cu): 0.1/0.1mm |
|
3 |
Min Space Between Coverlay Openings |
0.2mm |
|
4 |
Edge of Coverlay Opening to Trace |
0.20mm(preferred) |
|
5 |
Min Space between coverlay & solder pad |
0.15mm |
|
6 |
Polyimide Films |
0.5 mil (12.5µ), 1 mil (25µ), 2 mils (50µ), 3 mils (75µ), 4mils (100µ) as custmer requested. |
|
7 |
Thermobond Adhesives |
Acrylic/Modified Acrylic, Modified Epoxy, Polyimide |
|
8 |
Copper Foils (RA or ED) |
1/3oz (12µ), 1/2oz (18µ), 1oz (35µ), 2oz (70µ) |
|
9 |
Stiffeners |
Polyimide, rigid FR4, PSA, metal, etc. |
|
10 |
FR-4 in Multi-layer Flex Circuits |
Laminated to flex circuit to create rigid flex boards, typically with vias. |
|
11 |
Surface Finish |
Electroless Ni/Au, Electrolytic soft/hard gold,
Tin plating, Imm.Tin, Entek/OSP |
|
12 |
Solder Resists |
Coverlay, Photo-Imagable Resist |
|
13 |
Hole tolerance |
±0.05mm |
|
14 |
Smallest Drill Size |
0.2mm |
|
15 |
Largest Drill Size |
6.35mm |
|
16 |
Smallest Slot Width |
0.35mm |
|
17 |
Min.spacing between holes |
0.15mm |
|
18 |
Minimum conductor edge to outline edge |
≥0.1mm |
|
19 |
Min Spacing between coverlay & conductor |
± 0.15mm |
|
20 |
Hole to outline edge |
≥ 0.10mm |
|
21 |
Max Layer to Layer Mis-registration |
± 0.10mm |
|
22 |
Tooling tolerances |
Steel(Hard) tooling : ± 0.05mm |
|
CNC drill/rout : ± 0.10mm |
|
Knife(Soft) tooling : ± 0.25mm |
|
23 |
Copper Plated Thickness (PTH only) |
8~15um; 20~30um; 30~70um(special) |
|
24 |
Au thickness |
Electroless: Ni/Au Ni: 2~6um;Au:0.035~0.075um
Electrolytic soft/hard gold Ni: 2~9um;Au: 0.035~0.1um |