General specification for Microwave/RF PCB

Layer count: 1-6
Board thickness: 0.2-3.2mm
Copper thickness: 0.5-4oz
Dielectric Constant(DK): 2.2-10.3
Min trace width/spacing: 4/4mil
Min drill hole size: 0.2mm
Surface treatment: HAL(Lead free), Immersion Gold/Tin/Silver, OSP, Gold Plating.
Material available: Teflon, Rogers, Taconic, Arlon, etc.

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Rogers 4350 PCB/Ceramic PCB

Layer count: Single-sided PCB
Board thickness: 0.8mm
Copper thickness: 1oz 
Dielectric Constant(DK): 3.48
Surface treatment: Immersion Gold

Rogers 4003 PCB/Ceramic PCB

Layer count: Double-sided PCB
Board thickness: 1.6mm
Copper thickness: 1oz 
Dielectric Constant(DK): 3.38
Surface treatment: Immersion Silver

Taconic TLX-8 PCB/PTFE/Teflon PCB

Layer count: Double-sided PCB
Board thickness: 1.6mm
Copper thickness: 3oz 
Dielectric Constant(DK): 2.55
Surface treatment: Immersion Silver

Arlon TC350 PCB

Layer count: Double-sided PCB
Board thickness: 0.8mm
Copper thickness: 2oz
Dielectric Constant(DK): 3.5
Surface treatment: Immersion Gold