General Specification for Rigid FR4 PCB
Layer Count: 1-40Layers
Material Available: CEM1, CEM3, FR4, High Tg FR4, Halogen free FR4, Teflon, Taconic, Arlon, Rogers.
Board thickness: 0.2-5.0mm
Finished copper thickness: 1-6oz
Min trace width/spacing: 4/4mil
Min hole size: 0.2mm
Colour of Solder Mask: Green, Blue, White, Black, Yellow, Red.
Colour of Silkscreen: White, Black, Yellow.
Surface treatment: HASL, HAL(Lead free), OSP, Gold Plating, Immersion Gold/Tin/Silver.
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Heavy Copper PCB/Power supply PCB
Layer: 8
Material: FR4(Tg170)
Special art: 0.4mm machanical blind hole
Finished copper thickness: 7oz on each layer
Min trace width/spacing: 0.3/0.4mm(12/16mil)
Application: Power controls, Power Engine.
Multilayer PCB with Thick gold plating
Layer: 6
Material: FR4(Tg180)
Min trace width/spacing: 0.3/0.3mm(12/12mil)
Surface treatment: Hard gold plating (Au: 50u")
Application: Military
Multilayer PCB with CTI >600
Layer: 20
Material: FR4(Tg180)
Min trace width/spacing: 0.3/0.3mm(12/12mil)
Surface treatment: Immersion Tin
Application: Industrial
Multilayer PCB with Peelable mask
Layer: 6
Material: FR4(Tg150) HF
Min trace width/spacing: 0.3/0.3mm(12/12mil)
Surface treatment: ENIG
Application: Metering
Multilayer PCB with Immersion silver
Layer: 8
Material: FR4(Tg150) HF
Min trace width/spacing: 0.3/0.3mm(12/12mil)
Surface treatment: Immersion Silver
Application: Industrial